AWARDS:

    1.Transfer of technology: Low temperature Cu-Cu bonding for 3D IC application: Details

    2.Cadence Design Contest : Runner up, 2016 Details

    3.IEEE Sensors conference: Student paper award, 2nd Place, Poster, 2017 Details

    4.IWPSD Conference: Student paper award, 1st Place, 2017 Details

    5.Gandhian young technological innovation awards 2018

    6.INAE Best PhD thesis award 2018